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Single-side polishing machine

SP36

  • dimension:1280mm x722mm x 90mm(Water cooled)
  • material:SUS410 Stainless Steel + Special coating treatment
  • Rotational speed:5-60rpm

This machine is mainly used for gallium arsenide, silicon wafers, silicon carbide, sapphire wafers, germanium wafers, lithium niobate, glass and other hard and brittle materials, parallel plane single-side high precision and high efficiency polishing. The

Equipment characteristics

1. Use touch interface and PLC control, provide open graphical control interface.


2. The main drive has the characteristics of short transmission chain, stable and reliable.


3. The pressure of four PP heads is controlled separately and driven separately. The footwall is forced to be cooled by circulating cooling water, and the temperature is controlled accurately.


Equipment specifications

Name

Specifications

Remarks

  • footwall

    dimension

    1280mm x722mm x 90mm(Water cooled)

  • material

    SUS410 Stainless Steel + Special coating treatment

  • Rotational speed

    5-60rpm

  • Driving motor

    15KW AC380V 50Hz 1460rpm

  • Hanging plate

    dimension

    1280mm x722mm x 90mm(Water cooled)

  • material

    SUS410 Stainless Steel + Special coating treatment

  • Rotational speed

    3-35rpm

  • Driving motor

    11KW AC380V 50Hz 1460rpm

  • starboat

    parameter

    Involute teeth: 147 teeth, DP12

  • quantity

    9

  • Solar wheel

    Rotational speed

    3-35rpm

  • Driving motor

    2.2KW AC380V 50Hz 1400rpm

  • Tooth ring

    Rotational speed

    3-30rpm

  • Driving motor

    5.5KW AC380V 50Hz 1400rpm

  • Lifting machine

    0.75KW AC380V 50Hz 1400rpm

  • Lift stroke

    30mm

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